Process capability | |||||
No. | Technological process | Detailed | Production capacity | Sample and small batch capacity | |
1 | Material | Material thickness tolerance | If not specified:±10% | If not specified:±10% | |
2 | layers | FPC | 1-6layers | 1-8layers | |
Rigid-Flex | 2-6layers | 2-8layers | |||
3 | size | Minimum product size | 3*15mm | 2*10mm | |
Maximum product size | ≤600mm | ≤700mm | |||
4 | Material cutting | Cutting precision | ±0.2mm | ±0.1mm | |
5 | Drilling | Aperture tolerance | ±0.05mm | ±0.025mm | |
Hole position tolerance | ±0.05mm | ±0.05mm | |||
Minimum drilling distance(hole edge to hole edge) | ≥0.20 mm | ≥0.10 mm | |||
The distance between the inner hole and other network conductor | ≥0.20 mm | ≥0.15 mm | |||
Minimum laser drilling | 0.1mm | 0.075mm | |||
Nozzle size | 0.2mm~6.5mm | 0.15mm~6.5mm | |||
6 | copper deposition/copper plating | Aperture aspect ratio(thickness ratio aperture) | 5:1 | 6:1 | |
Minimum aperture | ≥0.1mm | ≥0.075mm | |||
Maximum thickness for hole copper | 35um | 50um | |||
Minimum thickness for hole copper | ≥10um | ≥10um | |||
7 | clean | Minimum thickness of Polishing FPC | ≥0.05mm | ≥0.05mm | |
Minimum thickness of cleaning FPC | ≥0.05mm | ≥0.05mm | |||
8 | Laminate | Deviation between layers | ±0.075mm | ±0.05mm | |
9 | Etching | Minimum line width/space control | Complete copper thickness:12-18um W/S:2.5/2.5mil | Complete copper thickness:18um W/S:2.0/2.0mil | |
18-35um W/S:4/4mil | 35um W/S:3/3mil | ||||
35-50um W/S:5/5mil | 50um W/S:4/4mil | ||||
50-70um W/S:7/7mil | 70um W/S:6/6mil | ||||
Tolerances for width and spacing | ±0.02mm(width and spacing≥0.3mm±10%) | ±0.015mm(width and spacing≥0.2mm±10%) | |||
Finger Pitch tolerance | 0≤Pitch≤30mm ±0.05mm 30<Pitch≤50mm ±0.08mm 50<Pitch≤100mm ±0.12mm | 0≤Pitch≤30mm ±0.05mm 30<Pitch≤50mm ±0.08mm 50<Pitch≤100mm ±0.12mm | |||
Minimum ring of through hole | ≥0.075mm | ≥0.075mm | |||
The minimum distance between the conductor and the outline or NPTH | ≥0.15mm | ≥0.10mm | |||
The innermost layer of the multilayer FPC, the smallest hole PAD ring | ≥0.1mm | ≥0.1mm | |||
10 | Punching hole | Standard tool hole dimensions | 2.0mm | 2.0mm or 3.0mm | |
Tool hole position tolerance | ±0.025mm | ±0.025mm | |||
Tool hole size tolerance | ±0.025mm | ±0.025mm | |||
The minimum distance from the center of the tool hole to the edge of the outline | ≥5mm | ≥4mm | |||
11 | Fit | Cumulative tolerance of covering film (including deflection, overflow, size tolerance, etc.) | ±0.20mm | ±0.15mm | |
Maximum overflow | ≤0.15mm | ≤0.08mm | |||
The minimum distance between the covering film and PAD | ≥0.12mm | ≥0.1mm | |||
The minimum distance of the covering film to a line or copper | ≥0.1mm | ≥0.1mm | |||
Minimum covering membrane width | ≥0.5mm | ≥0.3mm | |||
Minimum square window with covering film | 0.5*0.5mm | 0.5*0.5mm(open Precision mold or laser) | |||
Covering film opening to edge tolerance | ±0.20mm | ±0.15mm | |||
12 | FPC thickness | FPC minimum thickness | 0.07+/-0.03mm | 0.05+/-0.02mm | |
13 | Surface treatment | OSP | Organic protective film ( antioxidant treatment ) | ||
HASL, just for Rigid-flex outward processing | Sn:2um-40um | Sn:2um-40um | |||
HASL free, just for Rigid-flex outward processing | Sn:2um-40um | Sn:2um-40um | |||
ENEPIG, outward processing | Ni:1.0-6.0um Ba:0.10um Au:0.10um | Ni:1.0-6.0um Ba:0.10um Au:0.10um | |||
Hard gold plating, outward processing | Ni:1.0-6.0um Au:0.02um-0.5um | Ni:1.0-6.0um Au:0.02um-0.76um | |||
Soft gold plating, outward processing | Ni:1.0-6.0um Au:0.02um-0.1um | Ni:1.0-6.0um Au:0.02um-0.1um | |||
ENIG | Ni:120-200U" Au:1-3U" | Ni:120-200U" Au:1-3U" | |||
Immersion silver, outward processing | Ag:0.1-0.3um | Ag:0.1-0.3um | |||
Tin plating | 2um-15um | 2um-15um | |||
14 | PI stiffener | Fit tolerance | ±0.3mm | ±0.2mm | |
15 | FR4 stiffener | Fit tolerance | ±0.3mm | ±0.2mm | |
16 | Adhesive tape | Fit tolerance | ±0.50mm | ±0.30mm | |
17 | Solder Mask | Solder thickness | ≥15um | ≥15um | |
Ink color | White / black / yellow / green / red / blue | ||||
Oil minimum distance on PAD | ≥0.05mm | ≥0.04mm | |||
The minimum distance of oil from lines or copper | ≥0.05mm | ≥0.04mm | |||
Minimum resistance welding Bridge | 0.15mm | 0.12mm | |||
18 | Screen printing | Position tolerance | ±0.3mm | ±0.2mm | |
Ink color | White / black | ||||
Minimum screen width | ≥0.12mm | ≥0.10mm | |||
19 | Tool | Tolerances for precision molds(500 thousand punching times) | 0<L≤50mm ±0.05mm 50<L≤100mm ±0.075mm 100mm<L ±0.075%mm | The sample shape is Laser, the tolerance is as follows: 0<L≤50mm ±0.05mm 50<L≤100mm ±0.075mm 100mm<L ±0.075%mm | |
Tolerances for quick die(100 thousand punching times) | 0<L≤50mm ±0.10mm 50<L≤100mm ±0.125mm 100mm<L ±0.125%mm | ||||
Tolerances for medium wire die(200 thousand punching times) | 0<L≤50mm ±0.075mm 50<L≤100mm ±0.10mm 100mm<L ±0.1%mm | ||||
Tolerances for wood knife dies(50 thousand punching times) | 0<L≤50mm ±0.20mm 50<L≤100mm ±0.25mm 100mm<L ±0.25%mm | ||||
Tolerances for etching die(50 thousand punching times) | 0<L≤50mm ±0.10mm 50<L≤100mm ±0.125mm 100mm<L ±0.125%mm | ||||
Punch size | ≥0.5mm | any size | |||
20 | Laser | outline tolerance | tolerance:±0.05mm(L≤10mm) | tolerance:±0.05mm(L≤10mm) | |
Laser inner slot tolerance | tolerance:±0.05mm | tolerance:±0.05mm | |||
21 | Impedance | Impedance tolerance | Characteristic impedance:50Ω ±5Ω Differential impedance:100Ω ±10%Ω | Characteristic impedance:50Ω ±5Ω Differential impedance:100Ω ±10%Ω |
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