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Process capability
No.Technological processDetailedProduction capacitySample and small batch capacity
1MaterialMaterial thickness toleranceIf not specified:±10%If not specified:±10%
2layersFPC1-6layers1-8layers
Rigid-Flex2-6layers2-8layers
3sizeMinimum product size3*15mm2*10mm
Maximum product size≤600mm≤700mm
4Material cuttingCutting precision±0.2mm ±0.1mm 
5DrillingAperture tolerance±0.05mm±0.025mm
Hole position tolerance±0.05mm ±0.05mm
Minimum drilling distance(hole edge to hole edge)≥0.20 mm≥0.10 mm
The distance between the inner hole and other network conductor≥0.20 mm≥0.15 mm
Minimum laser drilling0.1mm0.075mm
Nozzle size0.2mm~6.5mm0.15mm~6.5mm
6copper deposition/copper platingAperture aspect ratio(thickness ratio aperture)5:16:1
Minimum aperture≥0.1mm≥0.075mm
Maximum thickness for hole copper35um50um
Minimum thickness for hole copper≥10um≥10um
7cleanMinimum thickness of Polishing FPC≥0.05mm≥0.05mm
Minimum thickness of cleaning FPC≥0.05mm≥0.05mm
8LaminateDeviation between layers±0.075mm±0.05mm
9EtchingMinimum line width/space controlComplete copper thickness:12-18um
W/S:2.5/2.5mil
Complete copper thickness:18um
W/S:2.0/2.0mil
18-35um
W/S:4/4mil
35um
W/S:3/3mil
35-50um
W/S:5/5mil
50um
W/S:4/4mil
50-70um
W/S:7/7mil
70um
W/S:6/6mil
Tolerances for width and spacing±0.02mm(width and spacing≥0.3mm±10%)±0.015mm(width and spacing≥0.2mm±10%)
Finger Pitch tolerance 0≤Pitch≤30mm   ±0.05mm
30<Pitch≤50mm   ±0.08mm
50<Pitch≤100mm ±0.12mm
0≤Pitch≤30mm   ±0.05mm
30<Pitch≤50mm   ±0.08mm
50<Pitch≤100mm ±0.12mm
 Minimum ring of through hole≥0.075mm≥0.075mm
The minimum distance between the conductor and the outline or NPTH≥0.15mm≥0.10mm
The innermost layer of the multilayer FPC, the smallest hole PAD ring≥0.1mm≥0.1mm
10Punching holeStandard tool hole dimensions2.0mm 2.0mm or 3.0mm
Tool hole position tolerance±0.025mm±0.025mm
Tool hole size tolerance±0.025mm±0.025mm
The minimum distance from the center of the tool hole to the edge of the outline≥5mm≥4mm
11FitCumulative tolerance of covering film (including deflection, overflow, size tolerance, etc.)±0.20mm±0.15mm
Maximum overflow≤0.15mm≤0.08mm
The minimum distance between the covering film and PAD≥0.12mm≥0.1mm
The minimum distance of the covering film to a line or copper≥0.1mm≥0.1mm
Minimum covering membrane width≥0.5mm≥0.3mm
Minimum square window with covering film0.5*0.5mm0.5*0.5mm(open Precision mold or laser)
Covering film opening to edge tolerance±0.20mm±0.15mm
12FPC thicknessFPC minimum thickness0.07+/-0.03mm0.05+/-0.02mm
13Surface treatmentOSPOrganic protective film ( antioxidant treatment )
HASL, just for Rigid-flex outward processingSn:2um-40um Sn:2um-40um 
HASL free, just for Rigid-flex outward processingSn:2um-40um Sn:2um-40um 
ENEPIG, outward processingNi:1.0-6.0um  

Ba:0.10um

 Au:0.10um

Ni:1.0-6.0um

Ba:0.10um

Au:0.10um

Hard gold plating, outward processing

Ni:1.0-6.0um

Au:0.02um-0.5um

Ni:1.0-6.0um

Au:0.02um-0.76um

Soft gold plating, outward processing

Ni:1.0-6.0um

Au:0.02um-0.1um

Ni:1.0-6.0um

Au:0.02um-0.1um

ENIG

Ni:120-200U"

 Au:1-3U"  

Ni:120-200U" 

Au:1-3U"  

Immersion silver, outward processingAg:0.1-0.3umAg:0.1-0.3um
Tin plating2um-15um 2um-15um 
14 PI stiffenerFit tolerance±0.3mm±0.2mm 
15FR4 stiffenerFit tolerance±0.3mm ±0.2mm 
16Adhesive tapeFit tolerance±0.50mm ±0.30mm
17Solder MaskSolder thickness≥15um  ≥15um 
Ink colorWhite / black / yellow / green / red / blue
Oil minimum distance on PAD≥0.05mm≥0.04mm
The minimum distance of oil from lines or copper≥0.05mm≥0.04mm
Minimum resistance welding Bridge0.15mm0.12mm
18Screen printingPosition tolerance±0.3mm±0.2mm
Ink colorWhite / black 
Minimum screen width≥0.12mm≥0.10mm
19ToolTolerances for precision molds(500 thousand punching times)0<L≤50mm  ±0.05mm
50<L≤100mm ±0.075mm
100mm<L ±0.075%mm              
The sample shape is Laser, the tolerance is as follows:
0<L≤50mm  ±0.05mm
50<L≤100mm ±0.075mm
100mm<L      ±0.075%mm
Tolerances for quick die(100 thousand punching times)0<L≤50mm  ±0.10mm
50<L≤100mm ±0.125mm
100mm<L      ±0.125%mm              
Tolerances for medium wire die(200 thousand punching times)0<L≤50mm  ±0.075mm
50<L≤100mm ±0.10mm
100mm<L      ±0.1%mm              
Tolerances for wood knife dies(50 thousand punching times)0<L≤50mm  ±0.20mm
50<L≤100mm ±0.25mm
100mm<L      ±0.25%mm              
Tolerances for etching die(50 thousand punching times)0<L≤50mm  ±0.10mm
50<L≤100mm ±0.125mm
100mm<L      ±0.125%mm              
Punch size≥0.5mmany size
20 Laseroutline tolerancetolerance:±0.05mm(L≤10mm)tolerance:±0.05mm(L≤10mm)
Laser inner slot tolerancetolerance:±0.05mmtolerance:±0.05mm
21ImpedanceImpedance toleranceCharacteristic impedance:50Ω ±5Ω
Differential impedance:100Ω ±10%Ω  
Characteristic impedance:50Ω  ±5Ω
Differential impedance:100Ω ±10%Ω