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Multilayer FPC board

Multilayer FPC board

The production method of multi-layer board is generally made by the inner layer graphics first, then the single-sided or double-sided substrate is made by etching method, and finally pressed.
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Description

Base material: 18um CU/20um AD
Coverlay: 20um AD/20um PI 
Machining process: Rolled Annealed Copper Foil (RA)
Surface Treatment: Immersion Gold
Application:  phone;Note-Book; Net-Book/E-Reader; DCS; LCM/HDD; 
DVD/CD-ROM; Printer/Scanner
 
Advantages: small size; light weight; flex for installation; dynamic flexibility;