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Process capability
No. Technological process Detailed Production capacity Sample and small batch capacity
1 Material Material thickness tolerance If not specified:±10% If not specified:±10%
2 layers FPC 1-6layers 1-8layers
Rigid-Flex 2-6layers 2-8layers
3 size Minimum product size 3*15mm 2*10mm
Maximum product size ≤600mm ≤700mm
4  Material cutting Cutting precision ±0.2mm  ±0.1mm 
5 Drilling Aperture tolerance ±0.05mm ±0.025mm
Hole position tolerance ±0.05mm  ±0.05mm
Minimum drilling distance(hole edge to hole edge) ≥0.20 mm ≥0.10 mm
The distance between the inner hole and other network conductor ≥0.20 mm ≥0.15 mm
Minimum laser drilling 0.1mm 0.075mm
Nozzle size 0.2mm~6.5mm 0.15mm~6.5mm
6 copper deposition/copper plating Aperture aspect ratio(thickness ratio aperture) 5:1 6:1
Minimum aperture ≥0.1mm ≥0.075mm
Maximum thickness for hole copper 35um 50um
Minimum thickness for hole copper ≥10um ≥10um
7 clean Minimum thickness of Polishing FPC ≥0.05mm ≥0.05mm
Minimum thickness of cleaning FPC ≥0.05mm ≥0.05mm
8 Laminate Deviation between layers ±0.075mm ±0.05mm
9 Etching Minimum line width/space control Complete copper thickness:12-18um
W/S:2.5/2.5mil
Complete copper thickness:18um
W/S:2.0/2.0mil
18-35um
W/S:4/4mil
35um
W/S:3/3mil
35-50um
W/S:5/5mil
50um
W/S:4/4mil
50-70um
W/S:7/7mil
70um
W/S:6/6mil
Tolerances for width and spacing ±0.02mm(width and spacing≥0.3mm±10%) ±0.015mm(width and spacing≥0.2mm±10%)
 Finger Pitch tolerance  0≤Pitch≤30mm   ±0.05mm
30<Pitch≤50mm   ±0.08mm
50<Pitch≤100mm ±0.12mm
0≤Pitch≤30mm   ±0.05mm
30<Pitch≤50mm   ±0.08mm
50<Pitch≤100mm ±0.12mm
 Minimum ring of through hole ≥0.075mm ≥0.075mm
The minimum distance between the conductor and the outline or NPTH ≥0.15mm ≥0.10mm
The innermost layer of the multilayer FPC, the smallest hole PAD ring ≥0.1mm ≥0.1mm
10 Punching hole Standard tool hole dimensions 2.0mm  2.0mm or 3.0mm
Tool hole position tolerance ±0.025mm ±0.025mm
Tool hole size tolerance ±0.025mm ±0.025mm
The minimum distance from the center of the tool hole to the edge of the outline ≥5mm ≥4mm
11 Fit Cumulative tolerance of covering film (including deflection, overflow, size tolerance, etc.) ±0.20mm ±0.15mm
Maximum overflow ≤0.15mm ≤0.08mm
The minimum distance between the covering film and PAD ≥0.12mm ≥0.1mm
The minimum distance of the covering film to a line or copper ≥0.1mm ≥0.1mm
Minimum covering membrane width ≥0.5mm ≥0.3mm
Minimum square window with covering film 0.5*0.5mm 0.5*0.5mm(open Precision mold or laser)
Covering film opening to edge tolerance ±0.20mm ±0.15mm
12  FPC thickness FPC minimum thickness 0.07+/-0.03mm 0.05+/-0.02mm
13 Surface treatment OSP \
HASL, just for Rigid-flex outward processing Sn:2um-40um  Sn:2um-40um 
HASL free, just for Rigid-flex outward processing Sn:2um-40um  Sn:2um-40um 
ENEPIG, outward processing Ni:1.0-6.0um  
Ba:0.10um                                                                             Au:0.10um
Ni:1.0-6.0um  
Ba:0.10um                                                                             Au:0.10um
Hard gold plating, outward processing Ni:1.0-6.0um                                                                                Au:0.02um-0.5um Ni:1.0-6.0um                                                                                Au:0.02um-0.76um
 Soft gold plating, outward processing Ni:1.0-6.0um                                                                                Au:0.02um-0.1um Ni:1.0-6.0um                                                                                Au:0.02um-0.1um
ENIG Ni:120-200U"                                                                                Au:1-3U"   Ni:120-200U"                                                                                Au:1-3U"  
Immersion silver, outward processing Ag:0.1-0.3um Ag:0.1-0.3um
Tin plating 2um-15um  2um-15um 
14  PI stiffener Fit tolerance ±0.3mm ±0.2mm 
15 FR4 stiffener Fit tolerance ±0.3mm  ±0.2mm 
16 Adhesive tape Fit tolerance ±0.50mm  ±0.30mm
17 Solder Mask Solder thickness ≥15um   ≥15um 
Ink color White / black / yellow / green / red / blue
Oil minimum distance on PAD ≥0.05mm ≥0.04mm
The minimum distance of oil from lines or copper ≥0.05mm ≥0.04mm
Minimum resistance welding Bridge 0.15mm 0.12mm
18 Screen printing Position tolerance ±0.3mm ±0.2mm
Ink color White / black 
Minimum screen width ≥0.12mm ≥0.10mm
19 Tool Tolerances for precision molds(500 thousand punching times 0<L≤50mm  ±0.05mm
50<L≤100mm ±0.075mm
100mm<L      ±0.075%mm              
The sample shape is Laser, the tolerance is as follows:
0<L≤50mm  ±0.05mm
50<L≤100mm ±0.075mm
100mm<L      ±0.075%mm
Tolerances for quick die(100 thousand punching times) 0<L≤50mm  ±0.10mm
50<L≤100mm ±0.125mm
100mm<L      ±0.125%mm              
Tolerances for medium wire die(200 thousand punching times) 0<L≤50mm  ±0.075mm
50<L≤100mm ±0.10mm
100mm<L      ±0.1%mm              
Tolerances for wood knife dies(50 thousand punching times) 0<L≤50mm  ±0.20mm
50<L≤100mm ±0.25mm
100mm<L      ±0.25%mm              
Tolerances for etching die(50 thousand punching times) 0<L≤50mm  ±0.10mm
50<L≤100mm ±0.125mm
100mm<L      ±0.125%mm              
Punch size ≥0.5mm any size
20  Laser outline tolerance tolerance:±0.05mm(L≤10mm) tolerance:±0.05mm(L≤10mm)
Laser inner slot tolerance tolerance:±0.05mm tolerance:±0.05mm
21 Impedance Impedance tolerance Characteristic impedance50Ω  ±5Ω
Differential impedance100Ω ±10%Ω  
Characteristic impedance50Ω  ±5Ω
Differential impedance100Ω ±10%Ω  
onshape Dimension  Actual product size range: The most stringent standard can be according to A grade without auxiliary materials; the most stringent according to B grade standard with auxiliary materials (except for FR4 reinforcement); the external dimensions with FR4 reinforced according to C grade standard                         Tolerance class
 
unmarked dimensioned 
Tolerance range
A B C
≤5 ±0.03 ±0.05 ±0.1
>5-15 ±0.05 ±0.1 ±0.15
>15-50 ±0.08 ±0.1 ±0.2
>50-100 ±0.1 ±0.2 ±0.3
>100 ±0.1% ±0.2% ±0.3%
unmarked angle ±0.5 ±0.5 ±1
Unmarked tolerance level selection C